Semiconductor manufacturing and design innovations are driving the revolution in smart products via smaller device architectures and more energy-efficient devices. Especially in the new 3D-IC, stacked-die, and FinFET architectures, shrinking geometries mean design challenges in power and reliability, which impact design closure. Achieve the accuracy and performance you need to determine the power noise integrity and reliability of complex ICs with ANSYS software for modeling and simulation (including thermal effects, electrostatic discharge phenomena, and electromigration.)
To begin your exploration of ANSYS semiconductors solutions, take a look at the related information below or download the ANSYS Capabilities Matrix (1 MB).
Next, feel free to contact us for further help. As an Elite ANSYS channel partner, our sales and engineering staff are experts in evaluating clients’ unique challenges and recommending solutions that satisfy current needs and budgets while laying out a path for future growth. In addition, please contact us to learn more about our ANSYS Consulting and Training services: