Semiconductor manufacturing and design innovations are driving the revolution in smart products via smaller device architectures and more energy-efficient devices. Especially in the new 3D-IC, stacked-die, and FinFET architectures, shrinking geometries mean design challenges in power and reliability, which impact design closure. Achieve the accuracy and performance you need to determine the power noise integrity and reliability of complex ICs with ANSYS software for modeling and simulation (including thermal effects, electrostatic discharge phenomena, and electromigration.)
Next, feel free to contact us for further assistance. As an Elite ANSYS channel partner, our sales and engineering staff are experts in evaluating clients’ unique challenges and recommending solutions that satisfy current needs and budgets while laying out a path for future growth. In addition, please contact us to learn more about our ANSYS Consulting and Training services:
As the de facto standard power integrity and reliability solution, ANSYS RedHawk accurately predicts chip power and noise using voltage drop simulation analysis for the entire power delivery network (PDN), from chip to package to board.
RedHawk-SC is the next-generation SoC power noise signoff platform to enable sub-16nm design success. RedHawk-SC is built on ANSYS SeaScape, the world's first custom-designed, big data architecture for electronic system design and simulation.
Path FX complements existing sign-off and physical design flows. It has the performance to evaluate all of the timing paths and clock trees in a SoC for delay and variance for even the largest designs.
Variance FX provides the most complete variation models for standard cells and custom macros. It creates both delay and constraint derates and .lib timing models for entire libraries.