Simulation Software & Services for Electronics

Electronics

MOCVD ChamberSimuTech Group has over 25 years of expertise in simulating a wide variety of electrical and electronic applications.  We have worked on projects in a number of disciplines within the electronics field.  Specifically, we have simulation experience in the product drop testing, Integrated Circuit (IC) package and device reliability, wafer fabrication processes, MEMS technology development, solar cell mechanical integrity, electronics cooling and thermal management, nanotechnology and its mechanics, and seismic/shock/vibration mechanical responses of electronic equipment and enclosures.

Our projects include the use of ANSYS FEA (finite element analysis) structural, thermal and electromagnetic analyses as well as CFD (computational fluid dynamics) analyses to help our customers answer questions arising throughout their product development cycle, from early concept refinement studies to later-stage manufacturability improvement efforts.  Our engineering contributions to our clients involve projects in manufacturability, performance, and reliability.  We have advanced our customers’ knowledgebase by performing advanced simulation studies of complex models such as the chemical vapor deposition processes in the semiconductor device manufacturing, complex 3D chip packaging stresses, and solder joint reliability predictions.

Major electronics corporations, large research institutions as well as small start-up companies have turned to SimuTech to meet their engineering analysis needs for various products within the electronics industry infrastructure.  We pride ourselves in being responsive to each client’s particular needs, from initial, quick concept development analyses to in-depth, highly complex multi-disciplinary analyses.  Our staff of over 40 advanced-degreed engineering professionals has the breadth and depth of experience to support our customers’ individual project requirements in the electronics industry.

Not convinced SimuTech is the right FEA and CFD consulting partner for you, then check out what our customers have to say about our technical expertise and customer service. 

To learn more about projects that have been done with ANSYS FEA and CFD software, please click on the specific electronic industry.

Semiconductor Manufacturing

Semiconductor Design

Aerospace &
Automotive Electronics
Networking &
Communication Equipment
MEMS Design Consumer Electronics Computer &
Storage Devices
Industrial Equipment &
Power Equipment

 

Semiconductor Wafer

Semiconductor Manufacturing

  • Silicon Wafer (Die) Manufacturing
    • Deposition: (CVD, plasma CVD, ALD
    • Dry etch: (metal, silicon, dielectric)
    • Chemical mechanical planarization
    • Electroplating
    • Epitaxy
    • Rapid thermal processing
    • Wet chemical cleaning
    • Ion implantation
    • Lithography exposure
  • Package Manufacturing
    • Encapsulation and curing
Memory Chip

Semiconductor Design

  • Integrated Circuts, Memory, Graphics Chips, RF Devices
  • Package Mechanical Reliability
    • Thermomechanical stress
    • Solder joint fatigue
    • Vibration and drop test
  • Electromagnetic Analysis
    • Interconnect parasitic extraction
    • Crosstalk and signal integrity
  • Thermal Management
    • Package thermal design
    • Die temperature profile
MEMS device

MEMS Design

  • Sensors, Actuators, Gyroscopes, Transducers, Thermal-Electric Coolers
  • Strong Interest in Physics Coupling
    • Piezoelectricity and Piezoresistivity
    • Electroelastic analysis
    • Thermal-structural coupling
    • Thermal-electric coupling
    • Thermal-electric-structural coupling
 Consumer Electronics

Consumer Electronics

  • MP3 players, Smart Phones, Game Counsels, Flat Screen TVs, GPS
  • Mechanical Reliability
    • Random Vibration
    • Drop test
    • Modal analysis
  • Electromagnetic Analysis
    • Antenna design
    • Human EM shielding
    • EM interference between devices
  • Thermal Management
    • Air cooling
    • Device enclosure temperature
 Aerospace Control Panel

Aerospace and Automotive Electronics

  • Automotive: Engine and safety controls, navigation, audio, LEDs
  • Aerospace: Avionics controls, airborne communication, surveillance and guidance systems, radar
  • Mechanical Reliability
    • Stress and deformations
    • Random shock and vibration
    • Modal analysis
  • Electromagnetic Analysis
    • Signal shielding
    • Antenna and radar design
  • Thermal Management
    • Natural and forced convection air cooling
    • Strong interest in PCB thermal analysis
    • Interest in trace joule heating
Hard Drive

Computer and Storage Devices

  • PCs, Servers, Super Computers, Hard Drives, Networking Storage Devices
  • Mechanical Reliability
    • Vibration and drop test
    • Rotordynamics
    • Modal analysis
    • Disk drive flutter (FSI)
  • Electromagnetic Analysis
    • Human EM shielding
    • EM interference between PCBs   and traces on PCBs
  • Thermal Management
    • Thermally-induced deflections in disk drive
    • Forced air cooling
    • Use of heat pipes, spray and emersion cooling
Router

Networking and Communication Equipment

  • Routers, Switches, Base Stations
  • Mechanical Reliability
    • Random vibration
    • Drop test
  • Electromagnetic Analysis
    • EM Shielding in enclosures
    • EM interference between PCBs and traces on PCBs
  • Thermal Management
    • Mostly forced air cooling
Electrical Converter

Industrial Equipment and Power Electronics

  • Electric Motors, Electric Converters, Switches, Transformers, Power Supplies
  • Mechanical Reliability
    • Random vibration
    • Modal analysis
    • Thermomechanical stress
  • Electromagnetic Analysis
    • EM shielding of enclosures
    • Electrostatic analysis
  • Thermal Management
    • Natural and forced convection air cooling
    • Interest in trace joule heating